All Computer Control BGA Rework Station/ BGA Repair System (RD430)

1. Intelligent heating, when fan untrasfer, heating is not powered on.
2. Top heating zone and bottom heating zone use finely heating material to produce high breeze. Welding is better than BGA bottom which only have infrared heating board machine.
3. The third heating zone uses far infrared heating board to pre-heating and prevent PCB board curve.
4.6 steps temperature control, all simulate reflow solder.
5. After the adoption of the heating of large flow constant fan on PCB for cooling to prevent PCB welding deformation, guaranteed results.
6. BGA unload, after welding, it has voice prompts.
7. The vacuum wand sucks BGA, convenient, reliable and durable.
8. Card board with a special tooling for a wide variety of notebook motherboard.
9. Using PLC, PC interface control.
10. COM interface and the PC is connected, and implements with the functionality of high-end rework machine. Monitor and PC host mixes.
11. The rich software features: Simple and friendly interface, set up, modify, save the parameter, the parameter groups does not limit their number, the temperature curve test, analyze, print, the saved; Automatically track the heating process, automatic drawing of the heatingn process curve; Temperature setting, temperature deviation correction, password locking mechanism, condition permitting mechanisms, etc.